Conférence ECTC San Diego

1-4 June, 2021

Reliability of Fan-Out Wafer Level Packaging for III-V RF Power MMICs” (prepared by UMS)

L Maréchal et al

Read it

System in package embedding III-V chips by fan-out wafer level packaging for RF applications”

Arnaud Garnier et al

Read it

CS Mantech

24-27 May, 2021

Evaluation of novel iron-free QuanFINE® structure by 100nm and 150nm AlGaN/GaN HEMT technology

Jan Grünenpütt et al

Download file

IMS2021 Atlanta

June, 2021

A 24-28 GHz Doherty Power Amplifier with 4 W Output Power and 32% PAE at 6 dB OPBO in 150 nm GaN Technology

Mingquan Bao et al

Download file

WSG-8: Workshop on Highly Linear and Linearized Power Amplifiers for mm-Wave Communications: RFIC Virtual Technical Program | RFIC Symposium (rfic-ieee.org)
Innovative Integrated Solutions for mm-Wave 5G Front Ends, Combining 150nm GaN PA with GaAs Receiver

Eric Leclerc et al

Download file

IEEE Microwave and wireless compound Volume 31 issue

6 June, 2021

A 24-28 GHz Doherty Power Amplifier with 4 W Output Power and 32% PAE at 6 dB OPBO in 150 nm GaN Technology

Mingquan Bao et al

Read it

5G GaN2 project developing 28GHz, 38GHz and 80GHz demonstrators for 5G cellular network base stations

Dirk Schwantuschke et al

Read it

ADEPT, Novy Smokovec, High Tatras, SLOVAKIA

14 – 17 September, 2020

DLTFS study of Emission and Capture processes in InAlGaN/GaN heterostructures with different passivation schemes.

J. Drobny et al

Download file

Investigation of Electrically Active Defects in InAlGaN/GaN/SiC HEMT

J. Vadovsky et al

Download file

Neural Network based Electrothermal Circuit Model of Power HEMT

A. Chvala et al

Download file

Study of Emission and Capture processes in AlGaN/GaN HEMTS for 5G

I. Stuchlikova et al

Download file

Newsletter #1

02 January, 2020

5G_GaN2 Newsletter No1 v1.0 (pdf)

MITAV 2019
(Mathematics, Information Technologies and Applied Sciences)
BRNO, CZECH REPUBLIC

Identification of electrical active defects in modern structures based on Gallium Nitride

J. Drobny, A. Kosa, M. Weis, J. Kovac, L. Stuchlikova

Download file

ADEPT Štrbské Pleso,
High Tatras, SLOVAKIA

24 – 27 June, 2019

Determination on chip temperature distribution of devices under operation by using Raman microscopy

J. Kováč jr., R. Szobolovszký, M. Florovič, J. Kováč, A. Chvála, T. Vincze

Download file

ADEPT Štrbské Pleso, High Tatras, SLOVAKIA

24 – 27 June, 2019

Channel temperature determination of HEMT in quasi-static operation

M. Florovič, R. Szobolovszký, J. Kováč, jr., J. Kováč, A. Chvála, J.-C. Jacquet, S. L. Delage

Download file

ADEPT Štrbské Pleso, High Tatras, SLOVAKIA

24 – 27 June, 2019

DLTFS study of GaN/AlGaN/GaN/SiC HEMT heterostructure with different layer compostion

J. Drobný, A. Kopecký, A. Kósa, P. Benko, M. Florovič 1, J. Kováč, jr., Ľ. Stuchlíková, S. L. Delage

Download file

ECSEL JU SYMPOSIUM,
BUCHAREST, ROMANIA

17-18 June 2019

5G_GaN2 Overview

Philippe Auxemery

Download file

IMS 2019,
BOSTON, USA

2-7 June 2019

International Microwave Symposium
Heterogeneous Integration for WLP RF Transceivers

Didier Floriot, Philippe Auxemery, Jean-Pierre Viaud

Download file

19th INTERNATIONAL CONFERENCE ON METALORGANIC VAPOR PHASE EPITAXY
USA

06 March 2019

Impact of growth conditions on AlN/GaN heterostructures with in-situ SiN capping layer

Joël Kanyandekwe, Yannick Baine, Jerome Richy, Sylvie Favier, Charles Leroux, Denis Blachier, Yann Mazel, Marc Veillerot, Jean-Paul Barnes, Mrad Mrad, Cindy Wiese, Matthew Charles

Download file

ASME 2018 IDETC-CIE,
SAN FRANCISCO, USA

26 – 29 August 2018

Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč

Download file

Journal of Electronic Packaging Vol 143

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN

Ales Chvala, Robert Szobolovszky, Jaroslav Kovacˇ Jr., Martin Florovicˇ, Juraj Marek, L’ubos-Cernaj, Daniel Donoval, Jaroslav Kovacˇ, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

Download file